Introduction to Semico nductor Manufacturing and FA Process
Back End(BE) Process Wafer Back Grinding • The typical wafer supplied from 'wafer fab' is 600 to 750μm thick. • Wafer thinned down to the required thickness, 50um to 75um, by abrasive grinding wheel. ... Semiconductor FA(Failure Analysis) Process 3 6 . mechanism, and provide feedback to the manufacturing and ...