US20090163119A1 - Method for Machining Chamfer Portion of ...
According to the present invention, in a method for subjecting a roughly ground chamfer portion of a semiconductor wafer to helical grinding by relatively inclining the wafer and a second grinding stone to perform precise grinding, an edge portion of a discoid truer is formed into a vertically asymmetrical groove shape of a first grinding stone by using the first grinding stone having …
