IDT Wafer-level Chip Scale Package (WLCSP) Implementation ...
solder ball arrays at 0.40mm pitch. Typical package height is 0.6mm nominal with 0.65mm being the maximum. 0.55mm max and 0.4mm max package heights are also available. IDT ships WLCSP in tape-and-reel (T&R) format. Tape-and-reel requirements are based on the EIA-481 standard. Pin 1identifiers are present
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